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STM32F101X8 Scheda tecnica(PDF) 73 Page - STMicroelectronics

Il numero della parte STM32F101X8
Spiegazioni elettronici  Medium-density access line, ARM®-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces
PDF  101 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F101X8 Scheda tecnica(HTML) 73 Page - STMicroelectronics

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STM32F101x8, STM32F101xB
Package characteristics
100
6
Package characteristics
6.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
6.2
UFQFPN48 package information
Figure 37. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to
the VSS or VDD power pads. It is recommended to connect it to VSS.
3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.



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