CC2560BYFVT datasheet(40/54 Pages) TI2

40 / 54 page

C. QFN (Quad Flatpack No-Lead) Package configuration.

B. This drawing is subject to change without notice.

A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5-1994.

NOTES:

Seating Plane

RVM (S-PVQFN-N76)

PLASTIC QUAD FLATPACK NO-LEAD

4211965/B 12/11

8,10

7,90

0,05

0,00

Pin 1 Indentifier

0,90

0,80

5,40

E. See the additional figure in the Product Data Sheet for details regarding the exposed thermal pad features and dimensions.

D. The package thermal pad must be soldered to the board for thermal and mechanical performance.

76X

0,15

0,25

4,80

0,30

0,50

76X

0,24

0,60

0,24

0,30 TYP

0,70

0,55

0,65

7,63

7,83

SWRS115-001

0,08 C

C A B

0,10

C A B

0,10

0,17

CL –

PKG.

CL –

PAD

THERMAL PAD

SIZE AND SHAPE

SHOWN ON SEPARATE SHEET

Bottom View

0,60

CC2560A NRND; CC2564 NRND

CC2560A, CC2560B, CC2564, CC2564B

SWRS121E – JULY 2012 – REVISED JANUARY 2016

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Product Folder Links: CC2560A CC2560B CC2564 CC2564B

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9.1

mrQFN Mechanical Data

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