TH3122

K-Bus Transceiver with integrated Voltage Regulator

Dec/04

Page 13

3901003122

Rev 004

Assembly Information

This Melexis device is classified and qualified regarding soldering technology, solderability and moisture sensitivity level,

as defined in this specification, according to following test methods:

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

CECC00802

Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed Quality

EIA/JEDEC JESD22-B106

Resistance to soldering temperature for through-hole mounted devices

EN60749-15

Resistance to soldering temperature for through-hole mounted devices

MIL 883 Method 2003 / EIA/JEDEC JESD22-B102

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,

temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with

Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive

strength between device and board.

Based on Melexis commitment to environmental responsibility, European legislation (Directive on the Restriction of the

Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has installed a roadmap to qualify their

package families for lead free processes also.

Various lead free generic qualifications are running, current results on request.

For

more

information

on

Melexis

lead

free

statement

see

quality

page

at

our

website:

http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf

ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.