OP297

Rev. F | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Supply Voltage

±20 V

Input Voltage

±20 V

1

Differential Input Voltage

40 V

1

Output Short-Circuit Duration

Indefinite

Storage Temperature Range

Z Package

−65°C to +175°C

P, S Packages

−65°C to +150°C

THERMAL RESISTANCE

Operating Temperature Range

OP297E (Z)

−40°C to +85°C

θ is specified for worst-case mounting conditions, that is, θ

JA

JA

is specified for device in socket for CERDIP and PDIP pack-

ages; θ

OP297F, OP297G (P, S)

−40°C to +85°C

Junction Temperature

JA

is specified for device soldered to printed circuit board

for the SOIC package.

Z Package

−65°C to +175°C

P, S Packages

−65°C to +150°C

Table 4. Thermal Resistance

300°C

Lead Temperature

(Soldering, 60 sec)

Package Type

θ

θ

Unit

JA

JC

8-Lead CERDIP (Z-Suffix)

134

12

°C/W

equal to the supply voltage.

8-Lead PDIP (P-Suffix)

96

37

°C/W

8-Lead SOIC (S-Suffix)

150

41

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

–

+

1/2

OP297

–

+

1/2

OP297

50kΩ

50Ω

2kΩ

CHANNEL SEPARATION = 20 log

Figure 4. Channel Separation Test Circuit