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ESDA18WY Scheda tecnica(PDF) 9 Page - STMicroelectronics |
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ESDA18WY Scheda tecnica(HTML) 9 Page - STMicroelectronics |
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9 / 13 page ![]() 3 Recommendations on PCB assembly 3.1 Recommended footprint Figure 22. Recommended footprint in mm 3.2 Stencil opening design • Stencil opening thickness: 75 μm to 125 µm / 3 mils to 5 mils • Stencil opening ratio : 90% Figure 23. Stencil opening recommendations 3.3 Solder paste 1. Halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Tack force high enough to resist component displacement during PCB movement. 4. Particles size 20-38 µm per IPCJ STD-005. ESDAxxWY Recommendations on PCB assembly DS14779 - Rev 1 page 9/13 |
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