5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

VDD to GND

Supply voltage

–0.5

6

V

VSEL to GND

Logic control input pin voltage

–0.5

6

V

VS or VD to

GND

Source or drain voltage (Sx, Dx) to ground

-7.5

7.5

V

ISEL

Logic control input pin current

–30

30

mA

IS or ID (CONT)

Source or drain continuous current (Sx, Dx)

IDC + 10 %(3)

mA

TA

Ambient temperature

–55

150

°C

Tstg

Storage temperature

–65

150

°C

TJ

Junction temperature

150

°C

Ptot

Total power dissipation(4)

750

mW

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

Refer to Source or Drain Continuous Current table for IDC specifications.

(4)

For WCSP package: Ptot derates linearily above TA = 70°C by 9.4mW/°C.

5.2 ESD Ratings

VALUE

UNIT

TMUX2889

V(ESD)

Electrost

atic

discharg

e

Human body model (HBM), per ANSI/

ESDA/JEDEC JS-001(1)

All pins

±2000

V

Charged device model (CDM), per ANSI/

ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

TMUX2821, TMUX2819

SCDS488 – DECEMBER 2025

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