LAN8804D datasheet(79/89 Pages) MICROCHIP

79 / 89 page

LAN8804D

DS00003591K-page 79

FIGURE 7-2:

128-TQFP PACKAGE (DIMENSIONS)

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

SECTION A-A

128-Lead Thin Quad Flat Pack (ZMX) - 14x14x1.0 mm Body [TQFP]

With 9x9 mm Grooved Exposed Pad

Microchip Technology Drawing C04-502 Rev B

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Foot Length

Lead Width

Molded Package Length

Molded Package Width

Overall Length

Overall Width

Foot Angle

Footprint

Standoff

Overall Height

Lead Pitch

Number of Leads

0.75

0.60

0.45

0.16

14.00 BSC

16.00 BSC

1.00 REF

0.13

0°

0.23

7°

1.00

0.40 BSC

128

NOM

MILLIMETERS

0.05

0.95

Units

MIN

1.05

0.15

1.20

0.10

MAX

Lead Bend Radius

0.08

Lead Bend Radius

0.08

0.20

Exposed Pad Length

9.00

8.90

9.10

Exposed Pad Width

Mold Draft Angle Bottom

11°

13°

12°

Lead Angle

0°

9.00

8.90

9.10

11°

13°

12°

Lead Thickness

0.09

0.20

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