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ADRF5420BCDZ-R7 Scheda tecnica(PDF) 12 Page - Analog Devices

Il numero della parte ADRF5420BCDZ-R7
Spiegazioni elettronici  Flip-Chip, Silicon SPDT Switch, 1GHz to 90GHz
PDF  14 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

ADRF5420BCDZ-R7 Scheda tecnica(HTML) 12 Page - Analog Devices

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Data Sheet
ADRF5420
APPLICATIONS INFORMATION
analog.com
Rev. 0 | 12 of 14
RECOMMENDATIONS FOR PCB DESIGN
The RF ports are matched to 50Ω internally, and the pinout is
designed to mate a coplanar waveguide (CPWG) with 50Ω charac-
teristic impedance on the PCB. Figure 18 shows the referenced
CPWG design for a 150µm thick Megtron6 2×1080 R‑5775G dielec-
tric material. The RF trace with 300µm width and 300µm gap is
used for 42µm finished copper thickness.
Figure 18. Probe Board Stackup
Figure 19. Recommended RF Pin Transitions
Figure 19 shows the recommended layout from the device RF
pins to the 50Ω CPWG. Signal pads have a 170µm diameter
extended with a neck for broadband tuning and tapered to RF trace
with a 45° angle. The optimized RF pin transitions for broadband
performance is given for different stackups in Table 8. For further
recomenndations on alternate PCB stackups with different dielectric
thickness and CPWG design, contact Analog Devices, Inc., Analog
Devices Support.
Table 8. Recommended RFx Pin Transitions for Different Stackups
RF Stackup Height and Dielectric
RF Trace Dimensions
ADRF5420
Mnemonics
Transition Dimensions
H (µm)
Er
W (µm)
G (µm)
N (µm)
L (µm)
85
3.02
180
250
RFC
100
190
RF1, RF2
100
215
100
3.34
200
225
RFC
120
190
RF1, RF2
120
165
115
3.40
225
250
RFC
120
140
RF1, RF2
120
165
125
3.00
250
225
RFC
120
90
RF1, RF2
120
165
1501
3.40
300
300
RFC
120
90
RF1, RF2
120
165
175
3.16
360
245
RFC
120
90
RF1, RF2
120
165
190
3.00
425
225
RFC
170
90
RF1, RF2
170
165
200
3.55
425
275
RFC
170
90
RF1, RF2
170
165
1 Design reference and generic footprint.



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