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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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TLE49SR Scheda tecnica(PDF) 36 Page - Infineon Technologies AG |
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TLE49SR Scheda tecnica(HTML) 36 Page - Infineon Technologies AG |
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36 / 40 page  7 Package information The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant. Table 34 Position tolerances die to package Parameter Symbol Values Unit Note / Test condition Min. Typ. Max. Tilt - - - 2 ° in respect to the z-axis and reference plane Rotational displacement - - - 3 ° in respect to the reference axis Placement tolerance in package - - - 100 µm in x and y direction z Tilt angle Reference plane y x Rotational displacement Package Chip x Die pad Chip Figure 24 Tolerance of the die in the package The package type is PG-TDSO-8-1. TLE49SR Datasheet 7 Package information Datasheet 36 Rev. 1.1.1 2024-03-13 |
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