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MPC8309CVMADFC Scheda tecnica(PDF) 9 Page - NXP Semiconductors

Il numero della parte MPC8309CVMADFC
Spiegazioni elettronici  PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications
PDF  81 Pages
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Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC8309CVMADFC Scheda tecnica(HTML) 9 Page - NXP Semiconductors

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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
9
Electrical Characteristics
2.1.2
Power Supply Voltage Specification
The following table provides the recommended operating conditions for the MPC8309. Note that these
values are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
The following figure shows the undershoot and overshoot voltages at the interfaces of the MPC8309
Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Recommended
Value
Unit
Note
Core supply voltage
VDD
1.0 V ± 50 mV
V
1
PLL supply voltage
AVDD1
AVDD2
AVDD3
1.0 V ± 50 mV
V
1
DDR2 DRAM I/O voltage
GVDD
1.8 V ± 100 mV
V
1
PCI, Local bus, DUART, system control and power management,
I2C, SPI, MII, RMII, MII management, eSDHC, FlexCAN,USB and
JTAG I/O voltage
OVDD
3.3 V ± 300 mV
V
1, 3
Junction temperature
TA/TJ
0to105
C2
Notes:
1. GVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or negative
direction.
2. Minimum temperature is specified with TA(Ambient Temperature); maximum temperature is specified with TJ(Junction
Temperature).
3. OVDD here refers to NVDDA, NVDDB, NVDDC, NVDDF, NVDDG, and NVDDH from the ball map.
GND
GND – 0.3 V
GND – 0.7 V
Not to Exceed 10%
G/OVDD + 20%
G/OVDD
G/OVDD + 5%
of tinterface1
1. tinterface refers to the clock period associated with the bus clock interface.
VIH
VIL
Note:



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