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AP3415AI Scheda tecnica(PDF) 2 Page - A POWER MICROELECTRONICS

Il numero della parte AP3415AI
Spiegazioni elettronici  -20V P-Channel Enhancement Mode MOSFET
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Produttore elettronici  APME [A POWER MICROELECTRONICS]
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AP3415AI
-20V P-Channel Enhancement Mode MOSFET
AP3415AI Rve:1.2
臺灣永源微電子科技有限公司
Electrical Characterizes @TA=25℃ unless otherwise specified
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
V(BR)DSS
Drain-to-Source breakdown voltage
VGS = 0V, ID = -250μA
-20
V
RDS(on)
Static Drain-to-Source on-resistance
VGS=-4.5V,ID = -4A
37
43
VGS=-2.5V,ID = -4A
45
54
VGS=-1.8V,ID = -2A
56
73
VGS(th)
Gate threshold voltage
VDS = VGS, ID = -250μA
-0.3
-1.0
V
TJ = 125°C
-0.44
IDSS
Drain-to-Source leakage current
VDS = -16V,VGS = 0V
-1
μA
TJ = 125°C
-50
IGSS
Gate-to-Source forward leakage
VGS =8V
10
μA
VGS = -8V
-10
Qg
Total gate charge
ID = -4A,
VDS=-10V,
VGS = -4.5V
10
nC
Qgs
Gate-to-Source charge
0.77
Qgd
Gate-to-Drain("Miller") charge
3.5
td(on)
Turn-on delay time
VGS=-4.5V, VDS =-10V,
RGEN=3Ω,
10
ns
tr
Rise time
8.6
td(off)
Turn-Off delay time
29
tf
Fall time
13
Ciss
Input capacitance
VGS = 0V, VDS =-10V, ƒ =
1MHz
939
pF
Coss
Output capacitance
130
Crss
Reverse transfer capacitance
111
Source-Drain Ratings and Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
IS
Continuous Source Current
(Body Diode)
MOSFET symbol
showing the integral
reverse p-n junction diode.
-4.2A ①
A
ISM
Pulsed Source Current
(Body Diode)
-30
A
VSD
Diode Forward Voltage
IS=1A, VGS=0V
-0.76
-1.0
V
trr
Reverse Recovery Time
TJ = 25°C, IF =-4A, di/dt =
100A/μs
8.7
ns
Qrr
Reverse Recovery Charge
2.3
nC
Notes:
①Calculated continuous current based on maximum allowable junction temperature.
②Repetitive rating; pulse width limited by max. junction temperature.
③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance.
④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C



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