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R8152S108B Scheda tecnica(PDF) 14 Page - Nisshinbo Micro Devices Inc. |
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R8152S108B Scheda tecnica(HTML) 14 Page - Nisshinbo Micro Devices Inc. |
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14 / 28 page ![]() R8152x NO. EC-238-180730 14 PACKAGE DIMENSIONS (TO-252-5-P2) (Unit : mm) 0.50 0.10 0.50 0.10 (0 ~8) S 0.12 M 0.50 0.10 0.10 6.60 0.20 5.34 0.20 C0.60 1.27 R0.325 R0.225 (4.19) (1.50) (5.04) 15 * TO-252-5-P2 Package Dimensions MARK SPECIFICATION (TO-252-5-P2) : Product Code … Refer to R8152J MARK SPECIFICATION TABLE : Lot Number … Alphanumeric Serial Number : Lot Sub Number …Alphanumeric Serial Number TO-252-5-P2 Mark Specification *) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. |
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