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DSC1001 Scheda tecnica(PDF) 12 Page - Microchip Technology |
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DSC1001 Scheda tecnica(HTML) 12 Page - Microchip Technology |
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12 / 31 page ![]() DSC1001/3/4 DS20005529D-page 12 2017 - 2025 Microchip Technology Inc. and its subsidiaries 7.0 SOLDER REFLOW PROFILE FIGURE 7-1: Solder Reflow Profile. 60-150 Sec 20-40 Sec 60-180 Sec 8 min max Pre heat Re ow Cool Time 200°C 217°C 150°C 25°C 260°C 60-150 Sec 20-40 Sec 60-180 Sec 8 min max Pre heat Re ow Cool Time 200°C 217°C 150°C 25°C 260°C 60-150 Sec 20-40 Sec 60-180 Sec 8 min max Pre heat Re ow Cool Time 200°C 217°C 150°C 25°C 260°C MSL 1 @ 260°C refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20 to 40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max. |
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