CLT3-4B

Package information

11/13

3

Package information

●

Epoxy meets UL94,V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 13.

TSSOP20 footprint (dimensions in mm)

Table 7.

TSSOP20 dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A1.2

0.047

A1

0.05

0.15

0.002

0.006

A2

0.8

1.0

1.05

0.031 0.039 0.041

b

0.19

0.3

0.007

0.012

c

0.09

0.2

0.003

0.007

D

6.4

6.5

6.6

0.252 0.256 0.259

E

6.2

6.4

6.6

0.244 0.252 0.256

E1

4.3

4.4

4.5

0.169 0.173 0.177

e

0.65

0.026

L

0.45

0.6

0.75

0.017 0.023 0.029

L1

1.0

0.039

k0°

8°

0°

8°

aaa

0.1

0.004

C

E1

E

A

A2

A1

b

D

aaa

C

C

Seating

plane

0.25 mm

Gage plane

k

L

L1

11

10

20

1

e

4.93

0.65

0.36

6.21

7.26