DIO7708

www.dioo.com

© 2025 Dioo Microcircuits Co., Ltd. Jiangsu

DIO7708• Rev. 2.4

Output Decoupling (COUT)

The DIO7708 does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The

device is designed to be stable with standard ceramic capacitors with values of 1 µF or greater. The X5R and

X7R types have the lowest capacitance variations over temperature. Thus they are recommendable.

Power Dissipation and Heat Sinking

The maximum power dissipation supported by the device is dependent upon board design and layout.

Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of

junction temperature rise for the part. For reliable operation junction temperature should be limited to 150°C.

The maximum power dissipation the DIO7708 can handle is given by:

JA

θ

A

MAX

J

MAX

D

R

T

T

=

P

]

[

)

(

)

(

-

(2)

The power dissipated by the DIO7708 for given application conditions can be calculated from the following

equations:

)

(

OUT

IN

OUT

GND

IN

D

V

V

×

I

+

I

×

V

P

-

≈

(3)

or

GND

OUT

OUT

OUT

+

MAX

D

MAX

IN

I

+

I

I

×

V

P

V

)

(

)

(

)

(

≈

(4)

Hints

VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces

is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components,

especially the output capacitor, as close as possible to the DIO7708, and make traces as short as possible.