ams Datasheet

Page 5

[v1-03] 2015-Aug-31

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AS3728 − Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. Depending on actual PCB layout and PCB used

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”.

Temperature Ranges and Storage Conditions

TA

Operating Temperature

-40

85

°C

RTHJA

Junction to Ambient Thermal

Resistance

°C/W

RTHJA ~ 42K/W (typ)

TJ

Junction Temperature

125

°C

TSTRG

Storage Temperature Range

-55

125

°C

TBODY

Package Body Temperature

260

°C

Norm IPC/JEDEC J-STD-020 (2)

RHNC

Relative Humidity (non-condensing)

5

85

%

MSL

Moisture Sensitivity Level

1

Represents an unlimited floor

life time

Symbol

Parameter

Min

Max

Units

Comments