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CMV8000

Soldering & Storage Information

Preliminary Datasheet

• PUBLIC

DS000609

• v1-00 • 2019-Jun-12

│ 86

Soldering & Storage Information

Attention

Image sensors with color filter arrays and micro lenses are particularly sensitive to high

temperatures. Prolonged heating at elevated temperatures may result in deterioration of the optical

performance of the sensor.

A socket is the safest way to avoid any thermal stress. When not using a socket, we recommend to

use manual hand soldering. Wave soldering can be used with precautions. Reflow soldering is not

recommended.

Manual Soldering: Use partial heating method and use a soldering iron with temperature control. The

soldering iron tip temperature is not to exceed 350 °C with a 270 °C maximum pin temperature. Touch

for a 2 seconds maximum duration per pin. Avoid touching and global heating of the ceramic package

during soldering. Failure to do so may later device performance and reliability.

Wave Soldering: Wave solder dipping can cause damage to the glass and harm the imaging capability

of the device. Avoid the solder to come in contact with the glass or ceramic body.

Figure 140:

Solder Reflow Profile Graph

CMV8000 Scheda tecnica(PDF) 87 Page - ams-OSRAM AG