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CS-TC08 Scheda tecnica(PDF) 2 Page - Wavelength Electronics, Inc. |
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CS-TC08 Scheda tecnica(HTML) 2 Page - Wavelength Electronics, Inc. |
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2 / 5 page ![]() Case Study CS-TC08 Rev. A Page 2 © 2023 • Sales & Technical Support: (406) 587-4910 • email: sales@teamWavelength.com • web: www.teamWavelength.com METHOD Researchers from the Laboratory for Electro-Optics Systems in Bengaluru, India, have developed and performed absorption spectroscopic studies of a compact, three-dimensional (3D) printed, magneto-optic (MO) package containing a chip-scale Rubidium atomic vapor cell. The printed MO package allows the integration of key components including the vapor cell, the VCSEL used as the light source, magnets for affecting how the light passes through the polarizing elements, quarter wave plates, the filters, and photodiode for sensing the light. These elements and cross-section of the MO package are shown in Figure 1. Figure 1. The schematic cross-section of the MO package. 1 – chip-scale vapor cell, 2 – VCSEL laser, 3 – annular magnets, 4 – collimating lens, 5 – ND filter, 6 – photodiode.1 The ability to 3D print the package eliminates high costs, allows custom design, and ensures accuracy and precision of up to 0.1 mm with a compact setup. The cross section in Figure 1 shows precisely machined slots for the variety of optical elements and vapor cell. The package is split into two sections: a slotted housing and the outer housing. Both of these sections can be seen in Figure 2. The slotted housing is comprised of the holder section that contains the optical elements and vapor cell as well as the cap section that is press-fitted on the holder section and sealed with epoxy to create a vibration-immune package for handling and testing purposes. The outer housing contains the electronic components of the setup: VCSEL laser, collimating lens, and a miniature electrical connector. Other components, like the current source and temperature controller are outside the MO package and connected to the appropriate elements. The MO package is made from a polylactic acid material creating a relatively low thermal conductivity design. This ensures good thermal isolation for the chip-scale vapor cell. Not only does this reduce how the temperature of the vapor cell affects the package and specifically the VCSEL temperature and output, but it reduces the steady state power consumption of the overall package.1 Figure 2. (a) showing the various components of the slotted MO housing 1 – photodetector on an acrylic holder, 2 – annular magnets, 3 – heater integrated Rb vapor chip, 4 – ND filter. (b) the closed slotted housing placed inside the outer housing.1 The chip-scale vapor cell's dimensions are 12 mm x 8 mm x 1.5 mm with an optical cavity 3 mm in diameter and an optical path length of 0.5 mm. The cell is designed with a glass-silicon-glass stack, and a Rb dispenser pill is used in the development stage and inserted into the cavity to be thermally activated and released. The boiling point of Rb is 39.48ºC. So, at room temperature, the Rb metal is in liquid phase and is found in condensed droplets on the windows of the cell. Therefore, the cell needs to be heated to transition the Rb metal into a vapor phase to observe atomic absorption resonances.1 To heat the Rb vapor cell to a temperature well above the boiling point, two approaches are taken and demonstrated: Nichrome (NiCr) and Indium Tin Oxide (ITO). Figure 3 shows both methods of heating the vapor cell as well as a thermal image under test. Figure 3. Heater integrated chip-scale Rb vapor cells (a) patterned NiCr heating element. (b) ITO coated vapor cell with aluminum contact pads. (c) thermal image of the integrated chip-scale heater under test.1 |
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