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CS-TC08 Scheda tecnica(PDF) 2 Page - Wavelength Electronics, Inc.

Il numero della parte CS-TC08
Spiegazioni elettronici  VCSEL Absorption Spectroscopy of Chip-scale Rubidium Atomic Vapor
PDF  5 Pages
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Produttore elettronici  WAVELENGTH [Wavelength Electronics, Inc.]
Homepage  https://www.teamwavelength.com/
Logo WAVELENGTH - Wavelength Electronics, Inc.

CS-TC08 Scheda tecnica(HTML) 2 Page - Wavelength Electronics, Inc.

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Case Study CS-TC08 Rev. A
Page 2
© 2023 • Sales & Technical Support: (406) 587-4910 • email: sales@teamWavelength.com • web: www.teamWavelength.com
METHOD
Researchers from the Laboratory for Electro-Optics
Systems in Bengaluru, India, have developed and
performed absorption spectroscopic studies of a compact,
three-dimensional (3D) printed, magneto-optic (MO)
package containing a chip-scale Rubidium atomic vapor
cell. The printed MO package allows the integration of key
components including the vapor cell, the VCSEL used as
the light source, magnets for affecting how the light passes
through the polarizing elements, quarter wave plates,
the filters, and photodiode for sensing the light. These
elements and cross-section of the MO package are shown
in
Figure 1.
Figure 1. The schematic cross-section of the MO
package. 1 – chip-scale vapor cell, 2 – VCSEL laser,
3 – annular magnets, 4 – collimating lens, 5 – ND filter, 
6 – photodiode.1
The ability to 3D print the package eliminates high costs,
allows custom design, and ensures accuracy and precision
of up to 0.1 mm with a compact setup. The cross section
in
Figure 1 shows precisely machined slots for the
variety of optical elements and vapor cell. The package
is split into two sections: a slotted housing and the outer
housing. Both of these sections can be seen in
Figure 2.
The slotted housing is comprised of the holder section that
contains the optical elements and vapor cell as well as the
cap section that is press-fitted on the holder section and
sealed with epoxy to create a vibration-immune package
for handling and testing purposes. The outer housing
contains the electronic components of the setup: VCSEL
laser, collimating lens, and a miniature electrical connector.
Other components, like the current source and temperature
controller are outside the MO package and connected to
the appropriate elements.
The MO package is made from a polylactic acid material
creating a relatively low thermal conductivity design. This
ensures good thermal isolation for the chip-scale vapor
cell. Not only does this reduce how the temperature of the
vapor cell affects the package and specifically the VCSEL
temperature and output, but it reduces the steady state
power consumption of the overall package.1
Figure 2. (a) showing the various components of the
slotted MO housing 1 – photodetector on an acrylic
holder, 2 – annular magnets, 3 – heater integrated Rb
vapor chip, 4 – ND filter. (b) the closed slotted housing 
placed inside the outer housing.1
The chip-scale vapor cell's dimensions are 12 mm x 8 mm x
1.5 mm with an optical cavity 3 mm in diameter and an
optical path length of 0.5 mm. The cell is designed with a
glass-silicon-glass stack, and a Rb dispenser pill is used
in the development stage and inserted into the cavity to
be thermally activated and released. The boiling point of
Rb is 39.48ºC. So, at room temperature, the Rb metal is
in liquid phase and is found in condensed droplets on the
windows of the cell. Therefore, the cell needs to be heated
to transition the Rb metal into a vapor phase to observe
atomic absorption resonances.1
To heat the Rb vapor cell to a temperature well above the
boiling point, two approaches are taken and demonstrated:
Nichrome (NiCr) and Indium Tin Oxide (ITO).
Figure 3
shows both methods of heating the vapor cell as well as a
thermal image under test.
Figure 3. Heater integrated chip-scale Rb vapor cells
(a) patterned NiCr heating element. (b) ITO coated vapor
cell with aluminum contact pads. (c) thermal image of
the integrated chip-scale heater under test.1



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