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LA-H9GP Scheda tecnica(PDF) 13 Page - ams-OSRAM AG |
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LA-H9GP Scheda tecnica(HTML) 13 Page - ams-OSRAM AG |
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13 / 23 page ![]() LA H9GP DATASHEET DATASHEET 13 | Version 1.8 | 2023-09-29 Electrical Internal Circuit Recommended Solder Pad 8) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. In case the PCB layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat sink must not be electrically connected to anode or cathode solder pad because of possible chip inverted polarity. Package not suitable for ultra sonic cleaning. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the customer is responsible to evaluate the combination of PCB board and solder paste material for his application. |
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