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LB-E63C Scheda tecnica(PDF) 13 Page - ams-OSRAM AG |
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LB-E63C Scheda tecnica(HTML) 13 Page - ams-OSRAM AG |
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13 / 24 page ![]() LB E63C DATASHEET DATASHEET 13 | Version 1.6 | 2022-08-03 Recommended Solder Pad 8) OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche /16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. |
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