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LO-T66F Scheda tecnica(PDF) 14 Page - ams-OSRAM AG |
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LO-T66F Scheda tecnica(HTML) 14 Page - ams-OSRAM AG |
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14 / 23 page ![]() LO T66F DATASHEET DATASHEET 14 | Version 1.1 | 2024-12-13 Recommended Solder Pad 9) OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. |
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