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LP-M676 Scheda tecnica(PDF) 11 Page - ams-OSRAM AG |
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LP-M676 Scheda tecnica(HTML) 11 Page - ams-OSRAM AG |
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11 / 22 page ![]() LP M676 11 Version 1.5 | 2019-07-15 Recommended Solder Pad 9) OHLPY978 Paddesign for improved heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm Wärmeableitung Padgeometrie für verbesserte Lötstopplack Solder resist 0.8 (0.031) 2.8 (0.110) 2 2 2.8 (0.110) 0.8 (0.031) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. |
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