LP T670

11 Version 1.1 | 2018-04-03

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.

Recommended Solder Pad 9)

OHLPY970

2.6 (0.102)

Cu-area > 16 mm

Cu-Fläche > 16 mm

2

2

Solder resist

Lötstopplack

2.6 (0.102)

Padgeometrie für

improved heat dissipation

verbesserte Wärmeableitung

Paddesign for

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.

Recommended Solder Pad 9)

OHLPY440

Padgeometrie für

verbesserte Wärmeableitung

improved heat dissipation

Paddesign for

Lötstoplack

Solder resist

0.8 (0.031)

2.3 (0.091)

3.3 (0.130)

Cu Fläche /16 mm per pad

2

Cu-area

_

<

3.3 (0.130)

Kathode/

Cathode

Anode

0.7 (0.028)

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact