LS-B6SP datasheet(1/22 Pages) AMSOSRAM

1 / 22 page

LS B6SP

1 Version 1.5 | 2020-06-29

Produktdatenblatt | Version 1.1

www.osram-os.com

Applications

LS B6SP

Power SIDELED®

Power SIDELED features a compact package with a

wide brightness range and high luminous efficiency.

—

Cluster, Button Backlighting

—

Signalling

Features:

—

Package: white PLCC-2 package, clear silicone resin

—

Chip technology: Thinfilm

—

Typ. Radiation: 120° (Lambertian emitter)

—

Color: λ

dom = 630.0 nm (● super red)

—

Corrosion Robustness Class: 3B

—

Qualifications: AEC-Q102 Qualified

—

ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Codice articolo simile - LS-B6SP

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
OSRAM GmbH	LS-B6SP	675Kb / 21P	white PLCC-2 package, clear silicone resin

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
OSRAM GmbH	LYB6SP	675Kb / 21P	Power SIDELED
	LTA673	588Kb / 21P	SIDELED
	LTA67C	582Kb / 21P	SIDELED
	SFH-325	401Kb / 15P	SIDELED
ams AG	SFH4256	897Kb / 16P	SIDELED® High Power Infrared Emitter (850 nm) Version 1.5 2020-08-26
	LOA67B	1Mb / 23P	SIDELED® Version 1.2 2019-07-16
	LOA67F	1Mb / 23P	SIDELED® Ambient Lighting Version 1.9 2022-09-01
	LOA67K	1Mb / 23P	SIDELED® Ambient Lighting Version 1.6 2022-09-01
	LGA676	1Mb / 21P	SIDELED® Version 1.3 2019-07-16
	LGA67K	1Mb / 24P	SIDELED® Version 1.5 2022-08-04