| Motore di ricerca datesheet componenti elettronici |
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LW-E6SC Scheda tecnica(PDF) 13 Page - ams-OSRAM AG |
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LW-E6SC Scheda tecnica(HTML) 13 Page - ams-OSRAM AG |
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13 / 22 page ![]() LW E6SC 13 Version 1.2 | 2018-07-11 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9) OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche /16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact |
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