R31DS0145EU0116 Rev. 1.16

Page 4

Sep 24, 2025

XK Datasheet

2. Specifications

2.1

Absolute Maximum Ratings

Caution: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such

conditions can adversely impact product reliability and result in failures not covered by warranty.

2.2

Recommended Operating Conditions

2.3

Thermal and Mechanical Specifications

Table 1. Thermal Characteristics - JEDEC Standard PCB

Parameter

Minimum

Maximum

Unit

VDD

GND - 0.5

GND + 3.8

V

All Other Pins

GND - 0.3

VDD + 0.3[1]

1. Not to exceed 3.6V.

V

Maximum Junction Temperature

-

+125

°C

Storage Temperature Range

-55

+125

°C

Human Body Model (Tested per JS-001-2017)

-

2

kV

Charged Device Model (Tested per JS-002-2018)

-

1

kV

Latch-Up (Tested per JESD78E; Class 2, Level A)

-

100

mA

Parameter

Minimum

Maximum

Unit

1.8V Nominal Supply Voltage, VDD

1.71

1.89

V

2.5V Nominal Supply Voltage, VDD

2.375

2.625

V

3.3V Nominal Supply Voltage, VDD

3.135

3.465

V

Ambient Temperature

-40

+85

°C

Package

θJA (°C/W) [1]

1. Still air.

θJB (°C/W) [2]

2. Device soldered to JEDEC standard PCB (4 × 4.5 inch 4-layer PCB, one thermal via, one PCB ground plane).

1814 Package (1612 footprint compatible)

113.2

56.7

2016 Package

114.1

61.1

2520 Package

93.1

39.4

3225 Package

92.0

42.6