SMP75-8

7/8

Figure 13: SMB Package Mechanical data

Figure 14: Foot Print Dimensions (in millimeters)

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.

Table 6: Ordering Information

Table 7: Revision History

Part Number

Marking

Package

Weight

Base qty

Delivery mode

SMP75-8

L08

SMB

0.11 g

2500

Tape & reel

Date

Revision

Description of Changes

19-July-2005

3

Previous issue

02-Jan-2006

4

Added ECOPACK statement and changed page layout.

Minor updates to technical values in Tables 2, 3, and 5.

E

C

L

E1

D

A1

A2

b

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A1

1.90

2.45

0.075

0.096

A2

0.05

0.20

0.002

0.008

b

1.95

2.20

0.077

0.087

c

0.15

0.41

0.006

0.016

E

5.10

5.60

0.201

0.220

E1

4.05

4.60

0.159

0.181

D

3.30

3.95

0.130

0.156

L

0.75

1.60

0.030

0.063

1.52

2.75

2.3

1.52