2

2 - 5

For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

Outline Drawing

HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657

Outline Drawing

HMC651 & HMC658

NOTES:

1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).

2. TYPICAL BOND PAD SPACING IS .006” CENTER TO

CENTER EXCEPT AS NOTED.

3. BACKSIDE METALIZATION: GOLD

4. BACKSIDE METAL IS GROUND

5. BOND PAD METALIZATION: GOLD

6. DO NOT BOND ON TOP OF GROUND VIAS

7. OVERALL DIE SIZE ±0.002”

Die Packaging Information [1]

Standard

Alternate

GP-5 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Analog

Devices Inc..

HMC650 to HMC658

v02.0218

WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz

HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658