HMC788A-EP

Enhanced Product

Rev. B | Page 8 of 8

OUTLINE DIMENSIONS

1.50

1.40

1.30

0.40

0.35

0.30

TOP VIEW

SIDE VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

0.90

0.85

0.80

0.90

0.80

0.70

0.203 REF

0.05 MAX

0.02 NOM

1.30 REF

0.65

BSC

EXPOSED

PAD

2.05

2.00 SQ

1.95

5

8

1

4

COPLANARITY

0.08

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

SEATING

PLANE

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 14. 6-Lead Lead Frame Chip Scale Package [LFCSP]

2 mm × 2 mm Body and 0.85 mm Package Height

(CP-6-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Moisture Sensitivity

Level (MSL) Rating2

Package Description

Package

Option

Marking

Code

HMC788ACPSZ-EP-PT

−55°C to +105°C

MSL3

6-Lead Lead Frame Chip Scale

Package [LFCSP]

CP-6-10

Y6V

HMC788ACPSZ-EP-R7

−55°C to +105°C

MSL3

6-Lead Lead Frame Chip Scale

Package [LFCSP]

CP-6-10

Y6V

1

Z = RoHS Compliant Part.

2

See the Absolute Maximum Ratings section.

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D16213-0-11/19(B)