Thermal management

L6227Q

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Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be delivered by the device in a safe operating condition. Therefore, it has to

be taken into account very carefully. Besides the available space on the PCB, the right

package should be chosen considering the power dissipation. Heat sinking can be achieved

using copper on the PCB with proper area and thickness. For instance, using a VFQFPN32L

5x5 package the typical Rth(JA) is about 22 °C/W when mounted on a double-layer FR4

connected through 18 via holes (9 below the IC).