Package information

TS924

10/14

4

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

4.1

DIP14 package information

Figure 13.

DIP14 package mechanical drawing

Table 6.

DIP14 package mechanical data

Ref.

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

a1

0.51

0.020

B

1.39

1.65

0.055

0.065

b0.5

0.020

b1

0.25

0.010

D20

0.787

E8.5

0.335

e

2.54

0.100

e3

15.24

0.600

F

7.1

0.280

I

5.1

0.201

L3.3

0.130

Z

1.27

2.54

0.050

0.100