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L6376 Scheda tecnica(PDF) 15 Page - STMicroelectronics |
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L6376 Scheda tecnica(HTML) 15 Page - STMicroelectronics |
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15 / 18 page ![]() L6376 Package mechanical data 15/18 12 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Table 6. PowerSO-20 mechanical data Dim. mm inch Min Typ Max Min Typ Max A 3.6 0.142 a1 0.1 0.3 0.004 0.012 a2 3.3 0.130 a3 0 0.1 0.000 0.004 b 0.4 0.53 0.016 0.021 c 0.23 0.32 0.009 0.013 D (1) 15.8 16 0.622 0.630 D1 (2) 9.4 9.8 0.370 0.386 E 13.9 14.5 0.547 0.570 e 1.27 0.050 e3 11.43 0.450 E1 (1) 10.9 11.1 0.429 0.437 E2 2.9 0.114 E3 5.8 6.2 0.228 0.244 G 0 0.1 0.000 0.004 H 15.5 15.9 0.610 0.626 h 1.1 0.043 L 0.8 1.1 0.031 0.043 N 8°(typ.) S 8°(max. ) T 10 0.394 |
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