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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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STTS424E02CDN3F Scheda tecnica(PDF) 48 Page - STMicroelectronics |
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STTS424E02CDN3F Scheda tecnica(HTML) 48 Page - STMicroelectronics |
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48 / 51 page  Landing pattern STTS424E02 48/51 13 Landing pattern The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN) are shown in Figure 19. The preferred implementation with wide corner pads enhances device centering during assembly, but a narrower option is defined for modules with tight routing requirements. Figure 19. Landing pattern - TDFN package (DN) e/2 e/2 e2 K K E2/2 E2/2 E2 D2/2 D2 D2/2 L L e b b b2 b4 K2 K2 K2 E3 E3 e4 ai14000 |
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