LIS331DL_08 datasheet(40/42 Pages) STMICROELECTRONICS

Il numero della parte	LIS331DL

Spiegazioni elettronici	MEMS motion sensor 3-axis - ±2g/±8g smart digital output -nano-accelerometer

PDF	42 Pages

Scroll/Zoom	100%

Produttore elettronici	STMICROELECTRONICS [STMicroelectronics]

Homepage	http://www.st.com

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40 / 42 page

Package information

LIS331DL

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Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK® is an ST trademark.

ECOPACK® specifications are available at: www.st.com.

Figure 25.

LGA 16: Mechanical data and package dimensions

Dimensions

Ref.

inch

Min. Typ. Max. Min.

Typ.

Max.

1.000

0.0394

0.7850.0309

0.200

0.0079

2.850

3.000

3.150 0.1122 0.1181 0.1240

2.850

3.000

3.150 0.1122 0.1181 0.1240

1.000

1.060

0.0394 0.0417

2.000

2.060

0.07870.0811

0.500

0.0197

1.000

0.0394

0.040

0.100

0.160 0.0016 0.0039 0.0063

0.875

0.0344

1.275

0.0502

0.2900.350

0.410 0.0114 0.0138 0.0161

0.190

0.250

0.310 0.0075 0.0098 0.0122

0.150

0.0059

0.050

0.0020

LGA16 (3x3x1.0mm)

Land Grid Array Package

Outline and

7983231

mechanical data

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