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LNBH23PPR Scheda tecnica(PDF) 28 Page - STMicroelectronics |
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LNBH23PPR Scheda tecnica(HTML) 28 Page - STMicroelectronics |
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28 / 32 page ![]() Package mechanical data LNBH23 28/32 OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.15 2.47 0.084 0.097 A2 2.15 2.40 0.084 0.094 a1 0 0.075 0 0.003 b 0.33 0.51 0.013 0.020 c 0.23 0.32 0.009 0.012 D (1) 10.10 10.50 0.398 0.413 E (1) 7.4 7.6 0.291 0.299 e 0.8 0.031 e3 8.8 0.346 G 0.10 0.004 G1 0.06 0.002 H 10.10 10.50 0.398 0.413 h 0.40 0.016 L 0.55 0.85 0.022 0.033 N 10˚ (max) X 4.10 4.70 0.161 0.185 Y 6.50 7.10 0.256 0.279 (1) “D and E1” do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.15mm (0.006”) (2) No intrusion allowed inwards the leads. (3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm per side PowerSSO -24 7412818 A (Exposed Pad) |
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