L5953_07 datasheet(29/31 Pages) STMICROELECTRONICS

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L5953

Package information

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Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 22.

PowerSO36 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

3.60

0.1417

0.10

0.30

0.0039

0.0118

3.30

0.1299

0.10

0.0039

0.22

0.38

0.0087

0.0150

0.23

0.32

0.0091

0.0126

15.80

16.00 0.6220

0.6299

9.40

9.80

0.3701

0.3858

13.90

14.5

0.5472

0.5709

10.90

11.10 0.4291

0.4370

2.90

0.1142

5.80

6.20

0.2283

0.2441

0.65

0.0256

11.05

0.4350

0.10

0.0039

15.50

15.90 0.6102

0.6260

1.10

0.0433

0.8

1.10

0.0315

0.0433

10˚ (max)

8˚ (max)

Note: “D and E1” do not include mold flash or protusions.

- Mold flash or protusions shall not exceed 0.15mm (0.006”)

- Critical dimensions are "a3", "E" and "G".

PowerSO-36

0096119 C

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