Package information

TDA7342

18/20

5

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 7.

LQFP32 Mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

0060661 D

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.600

0.0630

A1

0.050

0.150 0.0020

0.0059

A2

1.350

1.400

1.450 0.0531 0.0551 0.0571

b

0.300

0.370

0.450 0.0118 0.0146 0.0177

c

0.090

0.200 0.0035

0.0079

D

8.800

9.000

9.200 0.3465 0.3543 0.3622

D1

6.800

7.000

7.200 0.2677 0.2756 0.2835

D3

5.600

0.2205

E

8.800

9.000

9.200 0.3465 0.3543 0.3622

E1

6.800

7.000

7.200 0.2677 0.2756 0.2835

E3

5.600

0.2205

e

0.800

0.0315

L

0.450

0.600

0.750 0.0177 0.0236 0.0295

L1

1.000

0.0394

K

3.500

7.000

0.1378 0.2756

ccc

0.100

0.0039

LQFP32 (7 x 7 x 1.40mm)

Weight: 0.20gr