ECP2 datasheet(45/386 Pages) LATTICE

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Architecture

Lattice Semiconductor

LatticeECP2/M Family Data Sheet

Figure 2-38. LatticeECP2M Banks

LatticeECP2/M devices contain two types of sysI/O buffer pairs.

Top (Bank 0 and Bank 1) sysI/O Buffer Pairs (Single-Ended Outputs Only)

The sysI/O buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of

single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be con-

ﬁgured as a differential input.

The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive

side of the differential input buffer and the comp (complementary) pad is associated with the negative side of

the differential input buffer.

Bottom (Bank 4 and Bank 5) sysI/O Buffer Pairs (Single-Ended Outputs Only)

The sysI/O buffer pairs in the bottom banks of the device consist of two single-ended output drivers and two

REF1(7)

GND

CCIO7

REF2(7)

REF1(6)

GND

CCIO6

REF2(6)

VREF1(2)

GND

CCIO2

V REF2(2)

VREF1(3)

GND

CCIO3

V REF2(3)

GND

VCCIO8

Bank 5

Bank 4

Bank 0

Bank 1

BOTTOM

SERDES

Quad

SERDES

Quad

SERDES

Quad

SERDES

Quad

TOP

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