Die information

RHFL7913A

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Die information

RHFL7913A adjustable is also available in die form. Space dice are electrically tested by

STMicroelectronics in such a way that, when mounted in proper thermal and electrical

substrate, they are in full compliance with equivalent packaged device:

DIE physical dimensions.

DIE size: 110 mils x 166 mils

DIE thickness: 375 µm +/-25 µm (14.8 mils +/- 1 mil)

Pad size:

Control pads: 184 µm x 184 µm

Interface materials

Top Metallization: Al/Si/Cu 1.05 µm +/- 0.15 µm

Backside metallization: None

Glassivation

Type: P.Vapox + Nitride

Thickness: 0.6 µm +/- 0.1µm + 0.6µm +/-0.08 µm

The SENSE pad is layout on the die but is not electrically connected to the IC and shall be

left non-bonded during hybrid bonding.

Figure 3.

DIE size