Package mechanical data

L6926

12/16

6

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Figure 3.

MSOP8 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.10

0.043

A1

0.050

0.150

0.002

0.006

A2

0.750

0.850

0.950

0.03

0.033

0.037

b

0.250

0.400

0.010

0.016

c

0.130

0.230

0.005

0.009

D (1)

2.900

3.000

3.100

0.114

0.118

0.122

E

4.650

4.900

5.150

0.183

0.193

0.20

E1 (1)

2.900

3.000

3.100

0.114

0.118

0.122

e

0.650

0.026

L

0.400

0.550

0.700

0.016

0.022

0.028

L1

0.950

0.037

k

0˚ (min.) 6˚ (max.)

aaa

0.100

0.004

Note:

1. D and F does not include mold flash or protrusions.

Mold flash or potrusions shall not exceed 0.15mm

(.006inch) per side.

MSOP8

(Body 3mm)