TSM108

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences

of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted

by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject

to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not

authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

© The ST logo is a registered trademark of STMicroelectronics

© 2006 STMicroelectronics - Printed in Italy - All Rights Reserved

STMicroelectronics GROUP OF COMPANIES

Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco

Singapore - Spain - Sweden - Switzerland - United Kingdom

© http://www.st.com

13/13

PACKAGE MECHANICAL DATA

14 PINS - PLASTIC MICROPACKAGE (SO)

Dim.

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.75

0.069

a1

0.1

0.2

0.004

0.008

a2

1.6

0.063

b

0.35

0.46

0.014

0.018

b1

0.19

0.25

0.007

0.010

C

0.5

0.020

c1

45° (typ.)

D (1)

8.55

8.75

0.336

0.344

E

5.8

6.2

0.228

0.244

e

1.27

0.050

e3

7.62

0.300

F (1)

3.8

4.0

0.150

0.157

G

4.6

5.3

0.181

0.208

L

0.5

1.27

0.020

0.050

M

0.68

0.027

S8° (max.)

Note : (1) D and F do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (.066 inc) ONLY FOR DATA BOOK.