Analog Integrated Circuit Device Data

6

Freescale Semiconductor

33975

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Thermal Resistance

Junction to Ambient

Between the die and the exposed die pad(4)

71

1.2

Peak Package Reflow Temperature During Reflow(5), (6)

Note 6

°C

Notes

5.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

6.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent

damage to the device.

Rating

Symbol

Value

Unit

ELECTRICAL RATINGS