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STSJ25NF3LL Scheda tecnica(PDF) 3 Page - STMicroelectronics |
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STSJ25NF3LL Scheda tecnica(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() 3/8 STSJ25NF3LL Safe Operating Area SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE (*)Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. ( •)Pulse width limited by safe operating area. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) tr Turn-on Delay Time Rise Time VDD = 15 V ID = 12.5 A RG = 4.7 Ω VGS = 4.5 V (Resistive Load, Figure 1) 23 156 ns ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD=15V ID=25A VGS=4.5V (see test circuit, Figure 2) 24 8.5 12 33 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit td(off) tf Turn-off Delay Time Fall Time VDD = 15 V ID = 12.5 A RG = 4.7Ω, VGS = 4.5 V (Resistive Load, Figure 3) 27 28 ns ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD ISDM (•) Source-drain Current Source-drain Current (pulsed) 25 100 A A VSD (*) Forward On Voltage ISD = 25 A VGS = 0 1.2 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 25 A di/dt = 100A/µs VDD = 25 V Tj = 150°C (see test circuit, Figure 3) 40 50 2.5 ns nC A ELECTRICAL CHARACTERISTICS (continued) Thermal Impedance |
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