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TDA7560 Scheda tecnica(PDF) 8 Page - STMicroelectronics |
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TDA7560 Scheda tecnica(HTML) 8 Page - STMicroelectronics |
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8 / 10 page ![]() 0 2 468 10 Po (W) 5 10 15 20 25 30 35 40 45 50 55 60 Ptot (W) Vs= 13.2V RL= 4 x 2 Ohm CLIP START GAUSSIAN NOISE Figure 16. Power dissipation vs. output power (Music/Speech Simulation) 0 1 23456 Po (W) 5 10 15 20 25 30 Ptot (W) Vs= 13.2V RL= 4 x 4 Ohm CLIP START GAUSSIAN NOISE Figure 15. Power dissipation vs. ouput power (Music/Speech Simulation) APPLICATION HINTS (ref. to the circuit of fig. 1) SVR Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF time se- quence and, consequently, plays an essential role in the pop optimization during ON/OFF tran- sients.To conveniently serve both needs, ITS MINIMUM RECOMMENDED VALUE IS 10 µF. INPUT STAGE The TDA7560’s inputs are ground-compatible and can stand very high input signals ( ± 8Vpk) without any performances degradation. If the standard value for the input capacitors (0.1 µF) is adopted, the low frequency cut-off will amount to 16 Hz. STAND-BY AND MUTING STAND-BY and MUTING facilities are both CMOS-COMPATIBLE. If unused, a straight con- nection to Vs of their respective pins would be ad- missible. Conventional low-power transistors can be employed to drive muting and stand-by pins in absence of true CMOS ports or microprocessors. R-C cells have always to be used in order to smooth down the transitions for preventing any audible transient noises. About the stand-by, the time constant to be as- signed in order to obtain a virtually pop-free tran- sition has to be slower than 2.5V/ms. HEATSINK DEFINITION Under normal usage (4 Ohm speakers) the heatsink’s thermal requirements have to be de- duced from fig. 15, which reports the simulated power dissipation when real music/speech pro- grammes are played out. Noise with gaussian- distributed amplitude was employed for this simu- lation. Based on that, frequent clipping occurence (worst-case) will cause Pdiss = 26W. Assuming Tamb = 70 °C and TCHIP = 150°C as boundary conditions, the heatsink’s thermal resistance should be approximately 2 °C/W. This would avoid any thermal shutdown occurence even after long- term and full-volume operation. TDA7560 8/10 |
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