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MPC8641D Scheda tecnica(PDF) 93 Page - Freescale Semiconductor, Inc |
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MPC8641D Scheda tecnica(HTML) 93 Page - Freescale Semiconductor, Inc |
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93 / 140 page  MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1 Freescale Semiconductor 93 Package NOTES for Figure 57 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. 5. Capacitors may not be present on all devices. 6. Caution must be taken not to short capacitors or expose metal capacitor pads on package top. 7. All dimensions symmetrical about centerlines unless otherwise specified. 8. Note that for MPC8641 (single core) the solder balls for the following signals/pins are not populated in the package: VDD_Core1 (R16, R18, R20, T17, T19, T21, T23, U16, U18, U22, V17, V19, V21, V23, W16, W18, W20, W22, Y17, Y19, Y21, Y23, AA16, AA18, AA20, AA22, AB23, AC24) and SENSEVDD_Core1 (U20). |
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