LM75BDP datasheet(21/29 Pages) NXP

21 / 29 page

LM75B_2

Product data sheet

Rev. 02 — 9 December 2008

21 of 29

NXP Semiconductors

LM75B

Digital temperature sensor and thermal watchdog

13. Package outline

Fig 20. Package outline SOT96-1 (SO8)

UNIT

max.

cD(1)

E(2)

(1)

eHE

LLp

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

0.7

0.6

0.7

0.3

0.25

0.1

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

w M

b p

L p

detail X

v M A

(A )

pin 1 index

076E03

MS-012

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15

0.05

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.041

0.004

0.039

0.016

2.5

5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

99-12-27

03-02-18

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