Package information

Z04

6/8

3

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

REF.

DIMENSIONS

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

10.1

0.398

C7.3

0.287

D

10.5

0.413

F

1.5

0.059

H

0.51

0.020

J1.5

0.059

M4.5

0.177

N

5.3

0.209

N1

2.54

0.100

O

1.4

0.055

P

0.7

0.028

A

C

D

F

N1

N

P

O

J

M

H