Specifications subject to change without notice. All dimensions in inches. © Copyright 1998 The Connor-Winfield Corporation

2111 Comprehensive Drive

Aurora, Illinois 60505

Phone: 630- 851- 4722

Fax: 630- 851- 5040

www.conwin.com

Bulletin

SM036

Page

2 of 2

Revision

13

Date

18 Dec 2007

Pin Connections

1: Enable/Disable

2: Ground

3: Output

4: Vcc

OSCILLOSCOPE

FREQ

COUNTER

OSC

POWER

SUPPLY

INPUT FOR E/D

PROBE

Meets EIA-481A and EIAJ-1009B

2,000 PCS/Reel

Bypass capacitor, C-by, should be

ceramic capacitor ≥ .01 uf

SYMMETRY

Soldering

General Conditions 260°C max x 10 sec max x 2 times max or

230°C max x 180 sec max x 1 time

Typical Operation Data

(Vapor phase reflow)

20 to 100 sec up to 215°C, 50 sec

at 215°C, then down to room temperature per 1 to 5°C / sec

Environmental Characteristics

Temperature Cycle

The specimen shall meet electrical characteristics after

tested 5 cycles of -55°C / 30 minutes and +125°C / 30 minutes

Hermetical

No bubbles appear in Flourinert (FC-43) at 125°C ±5°C for 5 minutes

Solvent Resistance

Marking will withstand immersion in

Isopropyl Alcohol or Trichloroethylene

Suggested Pad Layout

Ordering Information

Mechanical Characteristics

Mechanical Shock

MIL STD 883 Method 2002

Vibration

The specimen shall meet electrical characteristics after tested

by the following conditions: 10-55Hz 1.5mm Amplitude,

55-2000 Hz 20 G's, 2 hours for each plane

Thermal Shock

After applied Thermal Shock of 260°C

max x 10 sec max x 2 times, or 230°C max x 180 sec max,

the specimen shall meet electrical characteristics

Solderability

(EIAJ-RCX-0102.101 Condition 1a)

1) Flux: MIL-F-14256 (WW Rosin=25%, Isopropyl Alcohol = 75%)

2) Solder: QQ-S-571 (Sn = 63%, Pb = 37%)

3) Solder bath temperature: 235°C ±5°C

4) Depth of immersion: Up to electrical terminal

5) Immersing time: Within 2 sec ±0.5 sec into solder bath

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

Test Circuit

Output Waveform

Tape and Reel Dimensions

Package Characteristics

Package

Hermetically sealed ceramic package and metal cover

Dimensional Tolerance: ±.02" (.508mm)

±.005" (.127mm)

HSM

6

1

044.736M

Type:

Temperature

Range:

Frequency

Tolerance:

Supply

Voltage:

Output Frequency:

Clock

7.5x5.0mm

Package

6 = -40 to 85˚C

1 = ± 25 ppm

2 = ± 50 ppm

3 = ± 100 ppm

Omit = 5.0 Vdc

Frequency Format

-xxx.xM Minimum *

-xxx.xxxxxxM Maximum*

*Amount of numbers after the decimal point.

M = MHz

Example: To Order an HSM61 with an output frequency of:

4 MHz = HSM61-004.0M

44.736 MHz = HSM61-044.736M

125 MHz = HSM61-125.0M