LTC4444 datasheet(3/12 Pages) LINER

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LTC4444

4444f

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC4444E is guaranteed to meet speciﬁcations from

0°C to 85°C. Speciﬁcations over the –40°C to 85°C operating

temperature range are assured by design, characterization and correlation

with statistical process controls. The LTC4444I is guaranteed over the full

–40°C to 85°C operating temperature range.

ELECTRICAL CHARACTERISTICS The ● denotes the speciﬁcations which apply over the full operating

temperature range, otherwise speciﬁcations are at TA = 25°C. VCC = VBOOST = 12V, VTS = GND = 0V, unless otherwise noted.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

High Side Gate Driver Output (TG)

VOH(TG)

TG High Output Voltage

ITG = –10mA, VOH(TG) = VBOOST – VTG

0.7

VOL(TG)

TG Low Output Voltage

ITG = 100mA, VOL(TG) = VTG –VTS

●

120

220

IPU(TG)

TG Peak Pull-Up Current

●

1.7

2.5

RDS(TG)

TG Pull-Down Resistance

●

1.2

2.2

Low Side Gate Driver Output (BG)

VOH(BG)

BG High Output Voltage

IBG = –10mA, VOH(BG) = VCC – VBG

0.7

VOL(BG)

BG Low Output Voltage

IBG = 100mA

●

110

IPU(BG)

BG Peak Pull-Up Current

●

RDS(BG)

BG Pull-Down Resistance

●

0.55

1.1

Switching Time (BINP (TINP) is Tied to Ground While TINP (BINP) is Switching. Refer to Timing Diagram)

tPLH(TG)

TG Low-High Propagation Delay

●

tPHL(TG)

TG High-Low Propagation Delay

●

tPLH(BG)

BG Low-High Propagation Delay

●

tPHL(BG)

BG High-Low Propagation Delay

●

tr(TG)

TG Output Rise Time

10% – 90%, CL = 1nF

10% – 90%, CL = 10nF

tf(TG)

TG Output Fall Time

10% – 90%, CL = 1nF

10% – 90%, CL = 10nF

tr(BG)

BG Output Rise Time

10% – 90%, CL = 1nF

10% – 90%, CL = 10nF

tf(BG)

BG Output Fall Time

10% – 90%, CL = 1nF

10% – 90%, CL = 10nF

Note 3: TJ is calculated from the ambient temperature TA and power

dissipation PD according to the following formula:

TJ = TA + (PD • θJA°C/W)

Note 4: Failure to solder the exposed back side of the MS8E package to the

PC board will result in a thermal resistance much higher than 40°C/W.

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