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LTM4607

4607f

APPLICATIONS INFORMATION

Table 4. Boost Mode

DERATING CURVE

VOUT (V)

POWER LOSS CURVE

AIR FLOW (LFM)

HEATSINK

θJA (°C/W)*

Figure 7, 9

12, 16

Figure 5

none

11.4

Figure 7, 9

12, 16

Figure 5

200

none

8.5

Figure 7, 9

12, 16

Figure 5

400

none

7.5

Figure 8, 10

12, 16

Figure 5

BGA Heatsink

11.0

Figure 8, 10

12, 16

Figure 5

200

BGA Heatsink

7.9

Figure 8, 10

12, 16

Figure 5

400

BGA Heatsink

7.1

Table 5. Buck Mode

DERATING CURVE

VOUT (V)

POWER LOSS CURVE

AIR FLOW (LFM)

HEATSINK

θJA (°C/W)*

Figure 11, 13

12, 20

Figure 6

none

8.2

Figure 11, 13

12, 20

Figure 6

200

none

5.9

Figure 11, 13

12, 20

Figure 6

400

none

5.4

Figure 12, 14

12, 20

Figure 6

BGA Heatsink

7.5

Figure 12, 14

12, 20

Figure 6

200

BGA Heatsink

5.3

Figure 12, 14

12, 20

Figure 6

400

BGA Heatsink

4.8

HEATSINK MANUFACTURER

PART NUMBER

PHONE NUMBER

Wakeﬁeld Engineering

LTN20069

603-635-2800

Aaivd Thermalloy

375424B00034G

603-224-9988

*The results of thermal resistance from junction to ambient θJA are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated

as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be

mentioned that poor board design may increase the θJA.

Figure 13. 36VIN to 20VOUT without Heat Sink

Figure 14. 36VIN to 20VOUT with Heat Sink

TYPICAL APPLICATIONS

AMBIENT TEMPERATURE (°C)

4607 F13

105

36VIN TO 20VOUT WITH 0LFM

36VIN TO 20VOUT WITH 200LFM

36VIN TO 20VOUT WITH 400LFM

AMBIENT TEMPERATURE (°C)

4607 F14

105

36VIN TO 20VOUT WITH 0LFM

36VIN TO 20VOUT WITH 200LFM

36VIN TO 20VOUT WITH 400LFM

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